Mitsubishi Electric Automotive Czech transforms a traditional factory into a connected, data-driven operation by upgrading legacy systems instead of buying new machinery.
ARME and Secartys Group are establishing a collaborative infrastructure to integrate mobile robotics and accelerate technological transformation across industrial automation sectors.
Powered by AMD Ryzen AI Embedded X100 processors, this COM-HPC module delivers high-performance heterogeneous computing for industrial automation, medical, and autonomous systems.
Schneider Electric and AMD developed a validated reference design for deploying high-density AI infrastructure with standardized power, cooling, and digital infrastructure.
Congatec has introduced the conga-HPC/cRX1 module to consolidate compute, graphics, and neural processing units for demanding industrial physical AI workloads.