Toshiba Electronics Europe GmbH (“Toshiba”) announces the availability of 20 new microcontroller devices for high-speed data processing of the TXZ+TM family advanced class. These M4G group products are now part of the TXZ+ family advanced class and are manufactured in a 40nm process.
T&M expert Rohde & Schwarz and Cadence have collaborated on a solution aimed at simplifying the engineering process from RF design to implementation and enhancing accuracy by using realistic signals for both simulation and testing. The new R&S VSESIM-VSS signal creation and analysis tool speeds up the development process for RF components. It is particularly useful for customers in the wireless, automotive, and aerospace and defense industries as well as for manufacturers of active components and systems.
Keyence has introduced a new range of inline telecentric measurement system which employ highly advanced silhouette-based analysis for guaranteed accuracy.
3D Systems (NYSE:DDD) today is pleased to announce an agreement to acquire Oqton, a software company that is a leader in the creation of a new breed of intelligent, cloud-based Manufacturing Operating System (MOS) platform.
At this year's Husum Wind from September 14-17, 2021 Beckhoff will be demonstrating its many years of know-how and its broad product range for the wind power industry. Among the highlights is a control cabinet optimized in terms of space requirements and wiring effort, which is only possible using the EtherCAT plug-in modules from the EJ series.
Good news for PLC and robot programmers! One of the core tasks of PROFIBUS & PROFINET International (PI) is the cross-manufacturer standardization of data interfaces for enabling easy, interoperable communication in automation systems.
DTA, a leading provider of intelligent solutions for factory and warehouse transportation, has announced the release of its new Dolphin line of autonomous guided vehicles (AGVs).