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Schneider Electric News
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SKF News
AI, agility and accessibility: customer-driven R&D at SKF
Renewed focus on usability and customer needs changes the way SKF conducts its research and development activities.
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Telit News
Telit Arduino Turnkey IoT Innovation Kit Enables Fast, Inexpensive LTE IoT Application Development
Featuring the Telit ME310 module, the new Charlie kit includes full coverage of NB-IoT and Cat M1 LTE bands, GNSS antenna with LNA and a Bosch accelerometer. The Arduino IDE-compatible microprocessor enables easy programmability, and the compact MKR form factor supports a wide variety of Arduino shields.
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Stemmer imaging News
Fully automated surface quality check of bearing balls
The Center of Device Development at the Fraunhofer Institute for Silicate Research ISC has developed a fully automated check system for bearing balls that is unique in the world. The sophisticated quality inspection system is based on machine vision components from STEMMER IMAGING.
29
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Hexagon Manufacturing Intelligence News
HEXAGON MAKES HXGN SFX
ASSET MANAGEMENT PRO AVAILABLE THROUGH ONLINE SHOPCustomers can now self-onboard to the PRO package of the cloud-based metrology device monitoring solution via shop.hexagonmi.com
29
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Stratasys News
BOEING QUALIFIES STRATASYS ANTERO 800NA MATERIAL FOR 3D-PRINTED FLIGHT PARTS
Enhanced chemical resistance and fatigue performance of the PEKK-based material over other alternatives provide Boeing with a new, high-performance option for polymer flight parts.
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LEINE LINDE LTM News
COMBINED MOUNTING OF 500 AND 600 SERIES ENCODERS
When you want feedback on both speed and position, you may want to combine an incremental and an absolute encoder on the same axis. This was the case for one of our customers, designing a high-voltage switch for a power generation application.
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Renesas News
Renesas Extends RA MCU Family with RA6T1 MCU Group for Motor Control and AI-based Endpoint Predictive Maintenance
Arm Cortex-M4-based MCU Rich Peripherals Reduce Motor Control BOM Cost and Supports Predictive Maintenance Solution with Google’s TensorFlow Lite for Microcontrollers
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AM Flow News
AM-FLOW STRENGTHENS ABILITY TO FULLY AUTOMATE THE ADDITIVE MANUFACTURING POST-PRINTING PROCESS WITH NEW MODULE
Company Earmarks Formnext Connect to launch new AM-BAGGING solution, empowering manufacturers to drive Industry 4.0 automation and increase efficiencies within high-volume, multi-printer environments.
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Baumer News
