07
'23
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Fraunhofer News
06
'23
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Global Certification Forum (GCF) News
GCF and TTA extend oneM2M certification programme with support for oneM2M Release 2
The Global Certification Forum and Telecommunications Technology Association has announced the activation of oneM2M Release 2 within GCF’s certification programme for oneM2M. Release 2 extends the scope of the oneM2M standard to meet the needs of the global IoT market.
06
'23
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U Blox News
U-blox LTE-M module fully certified in Japan
U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.
06
'23
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Intertronics News
Revolutionising temporary masking with Dymax SpeedMask
The use of Dymax SpeedMask®, available in the UK from adhesives specialist Intertronics, has enabled German aircraft engine manufacturer MTU Aero Engines AG to reduce its masking process time from four hours down to just 14 minutes.
06
'23
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TDK News
TDK collaborates with Texas Instruments on new i3 Micro Module, the world’s first sensor module with built-in edge AI and wireless mesh connectivity
TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.
06
'23
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Kontron News
Kontron shines with new brand identity, combining its IoT, software and 5G expertise
Already a trusted and well-established brand in the European and North American markets, Kontron continues to strengthen itself as the leading IoT and Industry 4.0 specialist helping customers undertake their digital transformation.
06
'23
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SICK News
SICK’s Next-Generation DGS80 Hollow-Shaft Encoders Open Up Universal Compatibility
An innovative design concept has opened up versatile integration possibilities for the DGS80 across wide-ranging industrial automation applications, aided by a radically-streamlined specification process and easy installation.
06
'23
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ams OSRAM News
Quadric and ams OSRAM collaborate to bring intelligent image sensors’ demonstration
Quadric, an innovator in machine learning processor IP for on-device AI, and ams OSRAM, a global leader in optical solutions, today announced a strategic collaboration to develop integrated sensing modules combining ams OSRAM’s leading edge Mira Family of CMOS sensors for visible and infrared with Quadric’s novel ChimeraTM GPNPU processors.
05
'23
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CEVA News
CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances
CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions has announced that LG Electronics (LG) has licensed and deployed the CEVA-XM4 intelligent vision DSP in its Edge AI system-on-chip 'LG8111' to advance the user experience of a new generation of smart home appliances.
05
'23
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Allied Electronics & Automation News
