09
'23
Written on
Toshiba News
09
'23
Written on
Autodesk News
AUTODESK INTRODUCES FORMA FOR NEXT-GENERATION BUILDING DESIGN IN THE CLOUD
Autodesk Forma is an industry cloud that will unify workflows across the teams that design, build and operate the built environment.
09
'23
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Leuze
Small Contrast sensor from Leuze
Many light types and compact housing: The new KRT 3C contrast sensor from Leuze can be flexibly integrated into packaging processes thanks to its multicolour capability and small size.
09
'23
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Nexcom News
NEXCOM INTRODUCES TT 300-A SERIES INTELLIGENT AI COMPUTING SYSTEM
TT 300-A2Q/A3Q is a high-performance system designed for machine automation and other AI computing applications.
08
'23
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Fluke Process Instruments News
Sensor+Test & SMTconnect provides thermal camera premiere and reflow temperature profiling
Fluke Process Instruments will be showcasing its temperature measurement solutions at the SENSOR+TEST and SMTconnect trade fairs in Nuremberg, Germany, May 9 – 11, 2023.
08
'23
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Emerson Automation Solutions
Emerson to unveil new approach to discrete automation at SPS Italia 2023
Visitors to Hall 6, Stand D 060 can view the Discrete Automation portfolio of ASCO, AVENTICS, Branson, Movicon, PACEdge and PACSystems, as well as CoreTigo solutions.
08
'23
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Mimaki News
Mimaki and Autodesk collaborate to create a full-colour 3D printed world
Mimaki, will present how to use Autodesk software and Mimaki's full-colour 3D technology to bring 3D data to life.
08
'23
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Mouser News
New at Mouser: STMicroelectronics introduces iNEMO Inertial Modules for Industrial and IoT Applications
The inertial modules combine digital accelerometer and gyroscope for optimal performance in industrial and IoT applications.
08
'23
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ST News
STMICROELECTRONICS LAUNCHES NEW ISPU TOOLCHAIN AND SOFTWARE PACKAGE
The new toolchain and software package from STMicroelectronics ease the development of edge processing with intelligent inertial sensors.
08
'23
Written on
3D SYSTEMS News
