14
'22
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IAR Systems News
14
'22
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Ultimaker News
Ultimaker and MakerBot Announce Closing of Merger
MakerBot and Ultimaker, two leaders in desktop 3D printing, today announced the completion of their merger. Under the new brand, UltiMaker, the company aims to provide easy-to-use and accessible 3D printing hardware, software, and materials for any application, driving the industry to a future state of responsible and sustainable manufacturing.
14
'22
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Stratasys News
Stratasys adds Evonik as new additive manufacturing material partner
Stratasys has announced that Evonik, one of the world’s leading specialty chemicals companies, is its third and newest material partner for the P3 technology-based Origin® One 3D printer.
14
'22
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Toshiba News
TOSHIBA TO EXHIBIT SOLUTIONS FOR POWER EFFICIENCY, SMART INDUSTRY, AND MOBILITY AT ELECTRONICA 2022
Toshiba Electronics Europe GmbH is to exhibit at Electronica 2022, showcasing solutions for a more energy efficient future. Booth C2.359 combines “Passion for Power Solutions” with demonstrations for Ethernet TSN and embedded control.
14
'22
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VOLLMER News
AMB 2022: ULTRATEC DEMONSTRATES THE A25 ULTRASONIC DEBURRING SYSTEM
For this purpose, the components are guided along in a process water basin upstream of a patented ultrasonic sonotrode, whose generated vibrations cause the burrs to oscillate in an energy-efficient manner and break off with sharp edges in a process-safe manner. Since July 2022, the start-up ultraTEC has been a company of the international VOLLMER GROUP from Biberach an der Riß.
14
'22
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Weidmueller News
Universal customer interface
Weidmüller expands industrial service platform “easyConnect” with a web configurator for PCB plug-in connector OMNIMATE®4.0. Last year, Weidmüller presented the industrial service platform “easyConnect” –which provides universal access to all of the company's digital services. It is far more than just “an account for all of Weidmüller’s digital services”.
14
'22
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Silicon Labs News
Silicon Labs Ushers in the Future of IoT at Works With Developer Conference
Silicon Labs, the leader in secure, intelligent wireless technology for a more connected world, today announced a slate of new products that further extend its multiprotocol-supporting, interoperability-driven, and robustly-secure portfolio with new products to advance the innovations and trends shaping the Internet of Things including Matter, Amazon Sidewalk, Wi-SUN, and Wi-Fi 6.
14
'22
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3D SYSTEMS News
3D Systems Expands Industry-leading Materials Portfolio with Introduction of New Production-grade Materials
3D Systems announced Figure 4® Tough Clear and DuraForm® PAx Black – two new production-grade materials designed to address a breadth of industrial applications. Both materials have been engineered for long-lasting mechanical performance and stability in any environment making them ideal for a host of end-use applications in industries such as consumer goods, transportation & motorsports, aerospace & defense, and service bureaus.
13
'22
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Rohde & Schwarz
Rohde & Schwarz first to deliver CTIA authorized 5G mmWave test system with multi-AoA capabilities in FR2
Rohde & Schwarz has cooperated with the US based CTIA organization to authorize the first multiple angles of arrival (multi-AoA) test system for CTIA OTA performance certification. The solution is based on the successful conformance test system R&S TS8980 while also leveraging the R&S CMX500 5G tester together with the R&S ATS1800M mmWave (FR2) chamber from the advanced chamber portfolio from Rohde & Schwarz.
12
'22
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NORD Drivesystems
