The new machine-level service ensures laser and bending systems are even better protected against cyber-events. It will be available as an option with in bystronic’s well-established service offerings and delivers on bystronic’s strategy to further expand its service business.
PC-based control, the PC- and EtherCAT-based control and drive technology from Beckhoff, offers great potential for making machines and systems for the plastics processing industry work more sustainably. The software is based on the TwinCAT 3 Plastic Framework, the TwinCAT Analytics data analysis solution, and TwinCAT OPC UA for communication according to the Euromap standard.
Mills CNC uses Micro-Epsilon laser sensors for the automatic inspection of large, hot-rolled railway fishplates made of steel. These fishplates join two rails together and must be as straight and flat as possible.
The road to hyper-automation in manufacturing requires strategic planning and decisions however, it is also important to realize that manufacturing simulation is critical to the successful implementation of hyper-automation.
DFI, the world's leading brand in embedded motherboards and industrial computers, unveiled its new smart factory and invited the media to tour the plant in Taoyuan.
The new fork sensors of the GS 04B and GS 08B series from Leuze detect even the smallest objects with absolute reliability. They are ideal for reliable detection in high speed applications.
NISE 70-T02/T03 features the 11th Gen Intel® Core i7/i5 processors, bringing ultimate performance to embedded computing. It offers greater performance and improved efficiency over predecessors, delivering next-level processing speeds and capabilities.
VIA Technologies, Inc, today announced that it will debut the VIA SOM-9X12 Module featuring the MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022, which takes place at the Makuhari Messe in Tokyo from October 26 to 28.