Continuous development and breakthrough technologies are advancing industrial communications, enabling them to reach new heights and ultimately writing the next chapter of the digital era. One of the key innovations that is unlocking significant opportunities and cutting-edge applications is Time-Sensitive Networking (TSN).
Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.
The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.
Embedded systems are at the core of today’s electronic devices, whether in consumer electronics, telecommunications, industrial, medical, automotive or aerospace applications. Flawless operation is crucial, and engineers face complex challenges when designing ever more compact embedded systems which meet today’s demands of efficiency, safety, reliability and interoperability. Rohde & Schwarz addresses these challenges with its wide-ranging test and measurement solutions showcased at the embedded world Exhibition & Conference 2023 in Nuremberg.
Specialist articles on Industry 4.0 generally emphasize the aspect of technical feasibility of the consistent, intelligent networking of machines, processes and personnel: What gateways, protocols and platforms will be needed to interlink machines from different manufacturers? What legal requirements have to be observed? How can security be designed to avoid hacker attacks?.
It is not often the case that product designers and purchasing managers are in agreement on using the same product. Stepper motors with the new dGo drive electronics from Dunkermotoren and MAE, both AMETEK brands, have succeeded in doing so.
Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.
Infineon Technologies AG, in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.
New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.