Bopla News

Founded in 1970 and based in Bünde, Germany, BOPLA Gehäuse Systeme develops and manufactures electronic enclosures and input solutions for industrial electronics. Its portfolio includes plastic and aluminium enclosures, HMI systems, membrane keypads, touchscreens and customised housing solutions, supported by machining, printing, assembly and integration services. BOPLA combines enclosure engineering with application-specific customisation to protect and operate electronic equipment in demanding environments. Part of the Phoenix Mecano Group, the company serves customers internationally across automation, mechanical engineering, measurement and control, medical technology, building systems and other electronics-intensive industries.

www.bopla.de

16 OCT '26

Written on {{ "2026-10-16T00:00:00+00:00" | date "longDate" }}

BOPLA Presents Versatile BoNext Electronics Enclosure Series

Modular enclosures combine concealed screw connections, ambient lighting, and IP68 protection for demanding applications.

Read more…

29 SEP '26

Written on {{ "2026-09-29T00:00:00+00:00" | date "longDate" }}

Advanced Electronic Enclosures with Active Thermal and Antenna Integration

BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.

Read more…

BOPLA Presents Versatile BoNext Electronics Enclosure Series

Modular enclosures combine concealed screw connections, ambient lighting, and IP68 protection for demanding applications.

Advanced Electronic Enclosures with Active Thermal and Antenna Integration

BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.

International